Dt Sheet. They can be widely used to control equipments. The company shall assume no responsibility for any problem involving a patent caused when applying the descriptions in the example. Derate by 8. The wiring density and the material of the set board must be chosen for thermal conductance of efficacy board. And P C max cannot be over the value of P T.
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BM Series Datasheet. AirPrime WS Series dat IC datasheet pdf-1N They can be widely used to control equipments. The company shall assume no responsibility for any problem involving a patent caused when applying the descriptions in the example. Derate by 8. The wiring density and the material of the set board must be chosen for thermal conductance of efficacy board.
And P C max cannot be over the value of P T. Small and light surface-mount packages require spicial attentions on solder mounting.
On solder mounting, pre-heating before soldering is needed. The following figure show an example of infrared rays refow. The difference of thermal expansion coefficeient between mounted substrates and IC leads may cause a failure like solder peeling or soler wet, and electrical characteristics may change by thermal stress.
Therefore, mounting should be done after sufficient confirmation for especially in case of ceramic substrates. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
Hitachi makes every attempt to ensure that its products are of high quality and reliability. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges.
Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
This product is not designed to be radiation resistant. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. Hitachi, Ltd. Nippon Bldg. Electronic Components Group. All rights reserved. Printed in Japan.
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